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Toyo Electronic Materials Co., Ltd.
Jimei Industrial Park No. 18

Mr. Xiao: 185-596-77928

sales@toyotape.com

PIS702-F
  • Product Name： PIS702-F
Description

Silicone-based PI film tape is based on plyimide film as the backing, and the adhesive layer is silicone-based. It provides excellent heat resistant performance, short-term resistance to 260℃, and resistance to deformation, tearing, chemical agents, and solvents.
Structure

Backing: PI film


Adhesive: Silicone


Release Liner: PET film or fluoroplastic film or N/A substrate
Adhesion Range： > 400 g/25mm
Total Thickness(Without Release Liner)： 0.06 mm ~ 0.09mm (Custom)
Features ■ PI film Heat resistant is not easy to shrink, and it can still maintain dimensional stability in a High Temp environment.
■ PI film is a kind of thin, high-strength insulating material and has good solvent resistance and chemical stability.
■ Silicone Heat resistant has good solvent resistance and chemical stability
■ The overall temperature resistance reaches 260℃
Usage ■ The shielding protection of the pure gold contact points on the printed circuit board in the wave soldering or hot air leveling process
■ In the High Temp environment, insulation and protection of coils, generators, capacitors, or transformers
■ Electronic insulation
■ During the dip soldering process, the cladding layer of the flexible printed circuit board
  • Color： 金黄色
  • Width(mm)： 510
  • Backing Thickness(mm)： 0.025
  • Backing Material： PI膜
  • Adhesive： Silicone
  • Thickness(mm)： 0.09±0.01
  • Adhesion(g/25mm)： >400
  • Remarks：

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