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Description |
Silicone-based PI film tape uses PI film as
Backing, and the adhesive layer is Silicone.
Provides excellent high temperature resistance,
short-term resistance to 250 ℃, and resistance
to deformation, tearing, and chemical and
solvent resistance. |
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structure |
Backing ： PI film
Adhesive： Silicone
Release liner： PET film
Adhesion： > 400 g/25mm
Total Thickness (withoutRelease liner)： 0.06 mm ~ 0.09mm (Custom)
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Feature |
■ PI film is resistant to high temperature and
is not easy to close, and it can still maintain
dimensional stability in a high temperature
environment.
■ PI film is a thin, high-strength insulating
material with good solvent resistance and
chemical stability.
■ Silicone has high temperature resistance and
good solvent resistance and chemical stability
■ The overall temperature resistance can reach
250℃
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Applications |
■ Masking protection of the pure gold contact
points on the printed circuit board in the wave
soldering or hot air leveling process
■ Insulation and protection of coils,
generators, capacitors, or transformers in high
temperature environments
■ Electronic insulation
■ During the dip soldering process, the cladding
layer of the flexible printed circuit board
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