PI film tape
| Backing ： | PI film |
| Adhesive： | Acrylic |
| Release liner： | Release paper or release film |
| Description： |
Standard PI film tape uses PI film as Backing, and the
adhesive layer is Acrylic. Suitable for insulation protection in high temperature environments. |
| Adhesion： | > 800 g/25mm |
| Total thickness(withoutRelease liner)： | 0.03 mm ~ 0.1mm (Custom） |
| Feature： |
■ PI film can withstand high temperatures up to 250℃, and
can maintain high dimensional stability in a high
temperature environment. It is not easy to close. ■ High-strength insulation material, good solvent resistance and chemical stability. ■ Combined with Acrylic, the adhesion can be adjusted ■ No silicon residue |
| Applications： |
■Applications for winding and fixing, parts such as
transformers, capacitors, coils and circuits ■ FPC (flexible printed circuit) coating ■ Battery outer layer or edge wrapping ■ Insulation Applications |
| TY No. | TY PI701-P, TY PI702-P |
| Backing ： | PI film |
| Adhesive： | Silicone |
| Release liner： | PET film or Fluoroplastic film |
| Description： |
Silicone-based PI film tape uses PI film as Backing, and the
adhesive layer is Silicone. Excellent high temperature resistance, short-term resistance to 260 ℃, resistance to chemicals and solvents. |
| Adhesion： | > 400 g/25mm |
| Total thickness(withoutRelease liner)： | 0.06 mm ~ 0.09mm (Custom） |
| Feature： |
■ PI film can withstand high temperature up to 280℃, it can
maintain high dimensional stability in high temperature
environment and it is not easy to close. ■ High-strength insulation material, good solvent resistance and chemical stability. ■ Combined with Silicone, can withstand high temperature 120℃～260℃ ■ The overall temperature resistance can reach 260℃ |
| Applications： |
■ Masking protection of the pure gold contact points on the
printed circuit board in the wave soldering or hot air
leveling process ■ Applications Winding and fixing of insulation in high temperature environments, such as coils, generators, capacitors or transformers ■ During the dip soldering process, the cladding layer of FPC (flexible printed circuit) ■ Insulation Applications |
| TY No. | TY PIS701-F, TY PIS702-F |
| Backing ： | Black PI film |
| Adhesive： | Acrylic |
| Release liner： | Release paper or release film |
| Description： |
The Backing of Matte black PI film tape is based on printing
BlackPI film, and the adhesive layer is Acrylic. Provide good UV and light Masking |
| Adhesion： | > 400 g/25mm |
| Total thickness(withoutRelease liner)： | 0.03 mm ~ 0.11mm (Custom） |
| Feature： |
■ This series mainly lies in the design of the original
film, The printed layer has excellent insulation properties (surface resistance≧10^10Ω) Printed layer can resist fingerprints The printed layer is resistant to rubbing The printed layer is solvent-resistant cleaning (specified solvent) ■ BlackApplications is suitable for masking or preventing light leakage, the thickness of the original black film is as thin as 20um ■ The printing layer can be customized |
| Applications： |
■ 窄小的空间里需要High adhesion黏合薄膜电子绝缘胶带 ■ Applications于电池外层的标贴或边缘包裹 |
| TY No. |
TY PIT701-B, TY PIT702-B TY PI2050-B, TY PI701-50B-A2 |
| Backing ： | PI film |
| Adhesive： | Anti-static ESDAcrylic |
| Release liner： | Release paper or release film 或 Anti-static ESD离型膜 |
| Description： | Anti-static ESDPI film tape是以Anti-static ESDPI film为 Backing , 胶层是Anti-static ESD胶 |
| Adhesion： | > 800 g/25mm |
| Total thickness(withoutRelease liner)： | 0.03 mm ~ 0.1mm (Custom） |
| Feature： |
■ Anti-static ESD protective film can effectively reduce the
static electricity and voltage generated during bonding and
peeling, prevent dust adsorption and avoid abnormal
appearance or performance caused by dirt ■ Anti-static ESD release film is optional for the substrate, which can effectively reduce the static electricity and voltage generated during the bonding and peeling. ■ Surface resistance can reach 10^11 ~ 10^12Ω ■ Optional Anti-static ESD release film for the substrate ■ PI film can still maintain dimensional stability in a high temperature environment |
| Applications： |
■ Applications for winding and fixing, parts such as
transformers, capacitors, coils and circuits ■ FPC (flexible printed circuit) coating ■ Battery outer layer or edge wrapping ■ Insulation Applications |
| TY No. |
| Backing ： | PI film |
| Adhesive： | Flame retardant adhesive |
| Release liner： | Release paper or release film |
| Description： | Flame retardant PI film tape uses PI film as Backing, and the adhesive layer is Flame retardant Acrylic |
| Adhesion： | |
| Total thickness(withoutRelease liner)： | |
| Feature： |
■ Fully environmentally friendly without halogen ■ Passed UL94 certification, Flame retardant grade reaches VTM-0 ■ PI film can still maintain dimensional stability in a high temperature environment ■ Adhesive has good initial adhesion |
| Applications： | ■ Insulation and protection of coils, generators, capacitors, or transformers in high temperature environments |
| TY No. | PIF2050-B |
